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Shenzhen Jiaqing Circuit Co., Ltd.

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1 Years
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IC Substrate Board

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IC Substrate Board

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PCBA

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Standard PCB

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Rigid‑Flex PCB

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Metal Based PCBS

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RF Microwave High‑Frequency PCB

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SPECIAL PCB

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Multilayer PCB

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Shenzhen Jiaqing Circuit Co., Ltd.
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 IC Substrate Board
China BT PCB for sale

BT PCB

BT Resin PCB IC Substrate, BGA Packaging Substrate Our BT resin IC substrate (Bismaleimide Triazine substrate) is a high-performance packaging ...
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China High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability for sale

High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability

BT (Bismaleimide Triazine) resin substrates, originally developed by Mitsubishi Gas Chemical, represent the dominant substrate material for semiconduc...
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China High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages for sale

High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball ...
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China High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications for sale

High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications

BT IC substrate is specifically engineered for high-frequency 5G RF modules, Antenna-in-Package (AiP), and millimeter-wave communication applications. ...
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China High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications for sale

High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT ...
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China High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP for sale

High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP

Coreless ETS (Embedded Trace Substrate) BT IC substrate eliminates the thick glass-cloth reinforced core to achieve ultra-thin profiles (as thin as 0....
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