Verified Supplier
1 Years
Shenzhen Jiaqing Circuit Co., Ltd.
Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs.
We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcing and SMT assembly. Our products serve high-end industries such as automotive electronics, industrial control, AI computing, telecommunications and medical electronics.
With mature manufacturing processes and stable supply-chain support, we handle rapid prototyping, small-batch and mass-production orders. We strive to provide reliable custom-printed circuit board solutions for global high-tech electronics customers.
| Company Name: | Shenzhen Jiaqing Circuit Co., Ltd. |
|---|---|
| Business Type: | Manufacturer |
| Employee Number: | 201~300 |
| Year Established: | 2012 |
| Total Sales Annual: | 20000000-50000000 |
| Company Location: | Building 1, Area A, Third Industrial Zone, Gonghe Community, Shajing Subdistrict, Bao'an District, Shenzhen |
| Factory Location: | Building 1, Area A, Third Industrial Zone, Gonghe Community, Shajing Subdistrict, Bao'an District, Shenzhen |
We are committed to providing one-stop, full‑process electronic manufacturing services covering four core areas: BOM sourcing, CAD design, PCB fabrication, and SMT assembly. In BOM sourcing, we offer professional component selection and supply chain procurement to ensure material quality and on‑time delivery. Our CAD design capabilities handle complex, high‑density, and high‑speed board designs, supporting up to 48 layers, 40,000 pins, and 28 Gbps differential signaling, meeting the most demanding requirements. Our PCB fabrication utilizes advanced precision processing, supporting minimum trace width/spacing of 2 mil, minimum mechanical drilled hole of 6 mil, and laser microvia of 4 mil, to satisfy high‑reliability product needs. Our SMT assembly is equipped with state‑of‑the‑art placement lines, enabling high‑accuracy surface‑mount and assembly. By integrating the entire chain from material procurement and design development to production assembly, we help customers effectively shorten R&D cycles, reduce overall costs, and enhance the market competitiveness of their final products.
| Parameter | Specification |
|---|---|
| Maximum number of layers | 48 layers |
| Maximum pin count | 40,000 |
| Maximum connection points (nets) | 20,000 |
| Minimum mechanical drilled hole | 6 mil |
| Minimum laser via (microvia) | 4 mil |
| Minimum trace width / spacing | 2 mil / 2 mil |
| Maximum number of BGAs per board | 15 |
| Minimum BGA pad pitch | 15 mil |
| Maximum BGA pin count per device | 2,400 |
| High‑speed differential signaling | 28 Gbps, and 14 Gbps up to 40 inches |
| Design methodology | Constraint‑driven design (rule‑driven design) |
| Market name: | Worldwide,South America,Eastern Europe,Southeast Asia |
|---|---|
| Contact Person: | Zeng |