Shenzhen Jiaqing Circuit Co., Ltd.
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Our BT resin IC substrate (Bismaleimide Triazine substrate) is a high-performance packaging substrate specially designed for BGA, CSP and advanced semiconductor chip packaging applications.
BT material features ultra-high Tg, excellent thermal stability, low thermal expansion coefficient and reliable dielectric performance, ideal for high-density fine pitch interconnection of semiconductor packages.
✅ High Tg BT Resin substrate, Tg＞250℃, outstanding heat resistance
✅ Fine pitch fabrication capability: Min line width 3mil (0.075mm), Min spacing 2mil (0.05mm)
✅ Advanced via technology: Blind via, buried via & through-hole available, via diameter down to 50μm
✅ Multiple surface finish: ENIG, ENEPIG, OSP for different chip bonding requirements
✅ Customizable layers: 2~12 layers, core thickness from 40μm to 200μm
✅ RoHS compliant, ISO9001 certified
✅ Prototype & mass production available, small MOQ accepted
IC packaging, BGA packaging, CSP, semiconductor devices, high-density microelectronic modules.
JQPCB is a professional manufacturer for high-end PCB & IC substrates. We provide one-stop service from Gerber review, prototype trial to volume mass production. Send us your Gerber files and specs for quotation.
